Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices
نویسندگان
چکیده
منابع مشابه
Photonic Packaging: Transforming Silicon Photonic Integrated Circuits into Photonic Devices
Dedicated multi-project wafer (MPW) runs for photonic integrated circuits (PICs) from Si foundries mean that researchers and small-to-medium enterprises (SMEs) can now afford to design and fabricate Si photonic chips. While these bare Si-PICs are adequate for testing new device and circuit designs on a probe-station, they cannot be developed into prototype devices, or tested outside of the labo...
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Our recent advances in solid-state optoelectronic materials and devices will be reviewed. In the area of glass optics, fabrication of novel microstructured and multi-core fibers and their use in realizing single mode lasers will be summarized. In organic and plastic optics, photorefractive polymers for 3D display applications and nonlinear optical polymers for high speed modulators in RF photon...
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ACKNOWLEGMENTS First and foremost, I would like to thank my advisor, Prof. Ali Adibi, for his support and guidance throughout my PhD years, and for giving me the chance to be a part of the Georgia Tech community. the past six years. for their kind efforts in reviewing the present dissertation, and for honoring me with their presence at my doctoral defense session. especially Devin Brown and Gar...
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ژورنال
عنوان ژورنال: Applied Sciences
سال: 2016
ISSN: 2076-3417
DOI: 10.3390/app6120426